SiC Crystal Growth Crucible

Name: SiC Crystal Growth Crucible
Brand: SiC Graphite
SKU: sic-crystal-growth-crucible
Availability: InStock
Rating: 4.9 (24 reviews)

Ultra-high purity graphite crucibles designed specifically for SiC PVT crystal growth. Engineered for low ash targets, including <10 ppm programs where specified, to reduce contamination risk during 2000°C+ operations.

Target Buyer:Procurement teams at SiC wafer and boule manufacturing facilities.

High-purity graphite crucible for SiC PVT crystal growth 1

Capability Highlights

Ultra-low ash targets for reduced metal contamination risk
Consistent thermal conductivity across batches
Precision CNC machining for controlled sealing interfaces

Typical Applications

SiC PVT Crystal Growth
High-temperature Semiconductor Sublimation

Engineering Focus

Purity certification verification
Thermal gradient stability
Mechanical strength under thermal shock

Key Evaluation Matrix

Metric	Typical Range	Why It Matters
Ash Content	< 5-10 ppm	Directly impacts crystal defect density.
Bulk Density	1.80 - 1.92 g/cm3 by grade	Higher density reduces open porosity and vapor penetration during SiC PVT growth.
Trace Metal Controls	Buyer-defined Fe, V, Ti, Al limits	Trace metals can enter the boule or wafer process if purification limits are vague.
Critical Interfaces	Drawing-defined OD, ID, thread, lid, and seal tolerances	Fit errors change thermal gradients and can shorten the replacement cycle.

Engineering Datasheet

Product-Level Technical Specifications

Values below are RFQ planning targets, not blanket guarantees. Final acceptance criteria should be frozen against drawings, process conditions, equipment model, and buyer qualification requirements.

Parameter	Target / Typical Scope	Engineering Note
Base material	Ultra-high-purity isostatic graphite selected by ash target, density, grain size, and thermal conductivity	PVT crucibles should not be quoted from geometry alone; graphite route controls contamination, strength, and thermal behavior.
Purity route	Post-machining purification aligned to buyer ash and restricted-element requirements	Purification after machining reduces the risk of tool, handling, and process contamination entering the growth zone.
Operating temperature	2000C+ SiC PVT review by source chemistry, atmosphere, growth cycle, and thermal gradient	Temperature alone is incomplete; vapor exposure, cycle count, and source-to-seed geometry affect crucible life.
Fit-critical geometry	OD, ID, height, wall thickness, lip, lid seat, groove, thread, and bottom radius by drawing	Small deviations can affect sealing, source loading, thermal gradient, and assembly clearance.
Surface finish	Buyer-defined machined or polished surface condition for source-contact and sealing areas	Surface condition affects powder handling, vapor interaction, cleaning, and inspection acceptance.
Packing boundary	Clean bagging, separators, impact protection, and crate support for fragile crucible features	A high-purity crucible can lose qualification value if contact surfaces are abraded or contaminated in transit.

Trace Impurity Review Table

Semiconductor programs should define restricted elements before sample production. The table helps procurement and process teams turn purity expectations into a measurable qualification file.

Element	Typical Limit	Why Controlled
Total ash	<5-10 ppm class by buyer acceptance plan where specified	Ash content is a direct qualification item for SiC crystal-growth consumables.
Fe / Ni / Cr	Restricted by buyer trace-metal table	Transition metals are commonly controlled to reduce crystal contamination and defect risk.
B / V / Ti	Defined by SiC growth sensitivity	Relevant for dopant background, micropipe risk review, and buyer-side traceability files.
Na / Ca / Mg	Project-specific limit or report-only scope by process need	Alkali and alkaline-earth elements can be included in buyer COA templates for clean hot-zone parts.

RFQ Evidence Package

These records reduce ambiguity before sample approval and repeat-order release.

Crucible drawing with OD, ID, height, wall thickness, lip, lid seat, groove, thread, radius, and datum references.
Purity requirement or restricted-element table tied to buyer acceptance criteria.
Material route showing graphite grade, purification sequence, and inspection scope.
CTQ dimensional report for fit-critical sealing, source-contact, and assembly interfaces.
Clean packing photos showing separators, bagging, feature protection, and crate orientation.

Equipment Compatibility Review

Compatibility should be treated as an engineering review, not a catalog claim. Equipment-family language helps buyers route the RFQ, while final production still depends on drawings, samples, coating allowance, and acceptance criteria.

Equipment Family	Compatible Part Scope	Buyer Validation Required
SiC PVT crystal-growth furnaces	Purified graphite source crucibles, lids, rings, liners, and mating hot-zone graphite hardware.	Confirm boule diameter, crucible drawing, source loading, growth temperature, ash target, and current failure mode.
High-temperature sublimation systems	Graphite crucibles and sublimation containers for contamination-sensitive 2000C+ material processing.	Confirm atmosphere, vapor chemistry, lid or thread interface, thermal cycle, and trace-element report scope.
TaC upgrade programs	Graphite crucible substrates prepared for TaC coating feasibility review or hybrid graphite / TaC hot-zone layouts.	Confirm coated and uncoated surfaces, coating thickness target, post-coating dimensions, and sample qualification path.

Open full OEM compatibility matrix

Product Selection Logic

Decision Factor	Selection Logic	Buyer Check
Purity boundary	Use purified graphite when the part is exposed to SiC source vapor, seed-zone gradients, or high-temperature sublimation.	Request ash and trace-metal limits, especially Fe, V, Ti, Al, and Ca.
Thermal geometry	Prioritize drawing fit, lid interfaces, ring gaps, and wall thickness over generic crucible dimensions.	Send OD, ID, height, thread, groove, and mating-part drawings together.
Replacement cycle	Choose grade and purification route around the real number of growth runs expected per part.	Share current cracking, erosion, or contamination failure photos if available.

Manufacturing and QC Flow

Stage	Production / QC Checkpoint	Buyer Evidence
1. Requirement freeze	Confirm furnace type, growth temperature, crucible interfaces, and purity target.	RFQ sheet with CAD, material grade, ash limit, and replacement-cycle goal.
2. Graphite selection	Match isostatic graphite density, grain size, and purification route to PVT risk.	Grade proposal with density, grain-size class, and ash-control plan.
3. CNC machining	Machine sealing faces, grooves, threads, and assembly features from approved drawings.	First-article dimensional report for CTQ features.
4. Purification and QA	Apply purification and verify trace-metal or ash acceptance criteria.	COA or agreed trace-element report by lot.
5. Clean packing	Protect machined graphite surfaces from dust, edge impact, and moisture.	Packing photos, labels, and export documents before shipment.

RFQ Checklist

Define required purity level (e.g., <10ppm ash)
Provide exact crucible dimensions and thread tolerances
Specify expected operating temperature
Confirm monthly volume forecast

Risk Controls

Impurity outgassing at 2000°C: Rigorous purification cycles and ICP-MS testing.

Product Gallery

High-purity graphite crucible for SiC PVT crystal growth 2

High-purity graphite crucible for SiC PVT crystal growth 3

High-purity graphite crucible for SiC PVT crystal growth 4

High-purity graphite crucible for SiC PVT crystal growth 5

Precision graphite crucible for semiconductor hot zone use 1

Precision graphite crucible for semiconductor hot zone use 2

Precision graphite crucible for semiconductor hot zone use 3

Buyer FAQ

What is your standard lead time for PVT crucibles?

Typically 4-6 weeks for initial batches, moving to VMI/stocking for mass production.

Which specifications matter most for SiC PVT graphite parts?

Start with ash and trace-metal limits, graphite density, grain-size class, CTQ dimensions, and the expected replacement cycle inside the PVT hot zone.

Should purification happen before or after machining?

For semiconductor hot-zone parts, purification is usually planned after machining so finished surfaces and complex features are included in the cleanliness route.

What should we send if the current crucible is failing early?

Send drawings, operating temperature, atmosphere, run count, failure photos, and any contamination data so the grade and purification route can be adjusted.

Related Resources

Procurement Next Steps

Compare the full product portfolio before locking material architecture.
Match the part to a process solution for thermal-field and contamination constraints.
Review OEM capability controls for machining, coating, purification, and export packaging.
Send a drawing-based RFQ with process, material grade, tolerances, quantity, and delivery target.

Inquiry Email

[email protected]

Email app

Include process, product type, drawing status, purity/coating target, dimensions, quantity forecast, operating conditions, and delivery date.

Instant Chat

+8618857971991

Chat on WhatsApp

Best for quick drawing checks, process fit questions, and RFQ clarification.