RFQ Preparation Checklist
- Required ash level
- Specific element restrictions (e.g., Fe, V, Ti)
Rigorous purification processes using high-temperature halogen gas treatments to reduce metal impurities (ash) to ultra-low levels (<5ppm) for semiconductor compliance.
| Program Metric | Typical Range | Procurement Value |
|---|---|---|
| Ash Content | < 5 ppm | Crucial for compound semiconductor yield. |
| Testing Method | ICP-MS or agreed trace-element report | A generic purity claim is not enough for semiconductor contamination control. |
| Handling Route | Post-purification clean handling and sealed packaging | Good purification can be lost through dirty machining or packaging steps. |
| Acceptance Limits | Buyer-defined ppm limits by element | Program-specific limits avoid disputes after parts are produced. |
| Decision Factor | Selection Logic | Buyer Check |
|---|---|---|
| Contamination sensitivity | Use project-specific trace-element limits when parts face crystal growth, epitaxy, or semiconductor thermal fields. | List restricted elements and required report format before production. |
| Process sequence | Purification should happen after rough machining when the finished geometry must stay clean. | Align machining, purification, final cleaning, and packaging sequence. |
| Evidence level | COA depth should match application risk; not every industrial part needs semiconductor-level reporting. | Define whether lot COA, sample report, or full element table is needed. |
| Stage | Production / QC Checkpoint | Buyer Evidence |
|---|---|---|
| 1. Limit definition | Translate contamination risk into ash and trace-element acceptance limits. | Restricted-element list and required report format. |
| 2. Process sequencing | Align machining, purification, cleaning, inspection, and packaging order. | Control plan or route card for high-purity parts. |
| 3. Purification | Apply high-temperature purification route appropriate to the material and geometry. | Lot-level purification record where required. |
| 4. Testing | Verify ash or trace-metal acceptance criteria using agreed method. | ICP-MS, COA, or element table per project scope. |
| 5. Clean handling | Seal and label parts so purified surfaces are not contaminated in transit. | Clean packing photos and labels. |
Yes, we provide batch-specific COAs including trace metal analysis.
Ash is the starting point. Sensitive programs should also define restricted trace elements and the required reporting method before production.
Yes. The report scope can be aligned to buyer risk, from lot COA to a specific trace-element table.
The route should include clean handling, sealed packing, and clear sequencing between machining, purification, final inspection, and export.
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Include process, product type, drawing status, purity/coating target, dimensions, quantity forecast, operating conditions, and delivery date.
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