Trace Impurity Review Table
Semiconductor programs should define restricted elements before sample production. The table helps procurement and process teams turn purity expectations into a measurable qualification file.
| Element | Typical Limit | Why Controlled |
|---|---|---|
| Ash content | Project-defined graphite or felt ash target | High-temperature hot zones can release contaminants if ash requirements are vague. |
| Outgassing boundary | Defined by vacuum level, bakeout, and furnace cleanliness requirement | Outgassing can affect vacuum recovery, furnace cleanliness, and process repeatability. |
| Dusting / fiber release | Surface treatment or handling route defined where dust is critical | Dust from felt or machined graphite can contaminate adjacent hot-zone parts. |
| Oxidation exposure | Oxygen, moisture, and air-leak risk reviewed by process | Graphite and carbon insulation need atmosphere boundaries to avoid rapid degradation. |




