Trace Impurity Review Table
Semiconductor programs should define restricted elements before sample production. The table helps procurement and process teams turn purity expectations into a measurable qualification file.
| Element | Typical Limit | Why Controlled |
|---|---|---|
| Ash content | Standard, purified, or semiconductor-grade target by project | Low-ash felt is required when insulation sits near crystal-growth or clean thermal-field zones. |
| Fiber dusting | Surface-sealed or foil-faced route where dust is not acceptable | Felt dust can contaminate heaters, shields, crucibles, and wafer-facing hot-zone hardware. |
| Volatile release | Bakeout or outgassing expectation defined by vacuum process | Vacuum furnaces need predictable pump-down and stable background cleanliness. |
| Handling contamination | Clean bagging and separator method defined before shipment | Soft and rigid insulation can carry dust or loose fibers if packing is treated only as logistics. |








