Trace Impurity Review Table
Semiconductor programs should define restricted elements before sample production. The table helps procurement and process teams turn purity expectations into a measurable qualification file.
| Element | Typical Limit | Why Controlled |
|---|---|---|
| Fiber architecture | 2D / 3D / reinforced route selected by load direction | Tray strength and sag resistance depend on fiber direction, not only thickness. |
| Density / porosity | Project-defined density and impregnation route | Density affects stiffness, oxidation behavior, machining edges, and usable service life. |
| Oxidation boundary | Vacuum / inert use; coating or treatment reviewed for oxygen exposure | High-temperature carbon fixtures need atmosphere control to prevent accelerated material loss. |
| Surface debris / edge damage | Visual acceptance and packing method defined by buyer | Large trays can abrade, chip, or shed debris if packed without separators and edge protection. |









